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| DNF324U-4 Features Package 5 type, Water clear epoxy Through-hole IRED/5 High Speed Type Product features High Speed : Cut-off Frequency 30 TYP. MHz (IF=50mA) Wide Distribution Lead-free soldering compatible RoHS compliant Peak Wavelength Half Intensity Angle Die materials Rank grouping parameter Soldering methods 850nm 35 deg. GaAlAs Sorted by radiant intensity per rank taping TTW (Through The Wave) soldering and manual soldering Please refer to Soldering Conditions about soldering. ESD Packing 2kV (HBM) Bulk : 200pcs(MIN.) Recommended Applications Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2006.8.31 Page 1 DNF324U-4 Through-hole IRED/5 High Speed Type Absolute Maximum Ratings Item Power Dissipation Forward Current Pulse Forward Current Derating (Ta=25 or higher) Reverse Voltage Operating Temperature Storage Temperature 1 (Ta=25) Symbol Pd IF IFRM IF IFRM VR Topr Tstg Absolute Maximum Ratings 150 100 1000 1.33 13.3 5 -30~+85 -30~+100 Unit mW mA mA mA/ mA/ V 1 IFRM Measurement condition : Pulse Width100s, Duty1/100 Electro-Optical Characteristics Item Symbol Characteristics TYP. MAX. MAX. MIN. TYP. TYP. TYP. TYP. TYP. MIN. TYP. TYP. Max. 1.6 2.0 100 15 30 13 850 45 35 20 30 10 3.4 (Ta=25) Conditions IF=50mA VR =5V IF=50mA IF=50mA IF=50mA IF=50mA IF=50mA IF=50mA DC5mA, -3db from 0.1MHz IF=50mA IFRM=500mA Unit Forward Voltage Reverse Current Radiant Intensity Total Output Power Peak Wavelength Spectral Half-width Half Intensity Angle Cut-off Frequency Response Time Pulse Forward Voltage VF IR IE Po p 21/2 fc tr/tf VFM V A mW/sr mW nm nm deg. MHz ns V 2004.11.17 Page 2 DNF324U-4 Through-hole IRED/5 High Speed Type Radiant Intensity Rank IEmW/s r R ank MIN. A B C D E 15 21 30 42 60 MAX . 30 42 60 84 120 IF = 50mA Condition (Ta=25) Please contact our sales staff concerning rank designation. 2004.11.17 Page 3 DNF324U-4 Through-hole IRED/5 High Speed Type Technical Data Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25, IF = 50mA Spatial Distribution Example Condition : Ta = 25 Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25 Duty Ratio vs. Pulse Forward Current Condition : Ta = 25, tw 100s Forward Current IF(mA) Forward Voltage : VF(V) Pulse Forward Current IFRM(A) Duty Ratio 2004.11.17 Page 4 DNF324U-4 Through-hole IRED/5 High Speed Type Technical Data Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Condition : tw100s, Duty1/100 Pulse Forward Current IFRM(mA) Forward Current : IF (mA) Ambient Temperature : Ta() Ambient Temperature : Ta() Ambient Temperature vs. Forward Voltage Condition : IF = 50mA Ambient Temperature vs. Peak Wavelength Condition : IF = 50mA Peak Wavelength p (nm) Forward Voltage VF(V) Ambient Temperature : Ta() Ambient Temperature : Ta() 2004.11.17 Page 5 DNF324U-4 Through-hole IRED/5 High Speed Type Technical Data Forward Current vs. Relative Total Power Condition : - - Pulse, tw100s, Duty1/100, Ta = 25 Ambient Temperature vs. Relative Total Power Condition : IF = 50mA Relative Total Power Relative Total Power Forward Current : IF (mA) Ambient Temperature : Ta () Frequency Condition : Ta = 25, IF = 50mADC5mA Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25, tw100s, Duty1/100 Pulse Forward Current : IFRM (mA) Relative Radiant Intensity (dB) Frequency (MHz) Pulse Forward Voltage : VFM(V) 2004.11.17 Page 6 DNF324U-4 Through-hole IRED/5 High Speed Type Package Dimensions (Unit: mm) 2004.11.17 Page 7 DNF324U-4 Through-hole IRED/5 High Speed Type TTW (Through The Wave) soldering Conditions Pre-heating Solder Bath Temp. Dipping Time Position 100 265 5s (MAX.) Resin surface temperature (MAX.) (MAX.) At least 3.0 mm away from the root of lead 1) The dip soldering process shall be twice maximum. 2) The product shall be cooled to normal temperature before the second dipping process. The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices" and "Soldering", and use it after the confirmation, please. Manual Soldering Conditions Iron tip temp. Soldering time and frequency Position 400 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) At least 3.0 mm away from the root of lead The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices" and "Soldering", and use it after the confirmation, please. 2007.8.31 Page 8 DNF324U-4 Through-hole IRED/5 High Speed Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Resistance to Soldering Heat Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency Applicable Standard EIAJ ED4701/100(101) EIAJ ED4701/300(302) EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(401) EIAJ ED4701/400(403) Testing Conditions Ta = 25, IF = Maxium Rated Current 2655, 3mm from package base Minimum Rated Storage Temperature(30min) Normal Temperature(15min) Maximum Rated Storage Temperature(30min) Normal Temperature(15min) Ta = 602, RH = 905% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 10N,1time (0.4 and Flat Package : 5N) 98.1m/s (10G), 100 2KHz sweep for 20min., XYZ each direction 2 Duration 1,000 h 10s Failure 0/25 0/25 5 cycles 0/25 1,000 h 1,000 h 1,000 h 10s 2h 0/25 0/25 0/25 0/10 0/10 Failure Criteria Items Luminous Intensity Forward Voltage Reverse Current Cosmetic Appearance Symbols Iv VF IR - Conditions IF Value of each product Luminous Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V - Failure criteria Testing Min. Value Spec. Min. Value x 0.5 Testing Max. Value Spec. Max. Value x 1.2 Testing Max. Value Spec. Max. Value x 2.5 Occurrence of notable decoloration, deformation and cracking 2007.8.31 Page 9 DNF324U-4 Through-hole IRED/5 High Speed Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the "Foreign Exchange and Foreign Trade Control Law," it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31 Page 10 |
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